Silicone Wafer Doping Machine
This system was commissioned by the customer to solve a problem which
occurs when silica dust is sprayed on the surface of a silicon wafer at
high speed. On each pass the layer of dust is slightly mounded causing
uneven deposition. This problem is caused by vibration in the
structure, to overcome this Micromech produced a system from rigid
aluminium extrusion, with Hauser HLE series actuators and microstepping
motors which gave the control and speeds required.
The system is controlled by a 6K indexer, linked to a PC with bespoke visual basic front-end.